C200HG-CPU63-E CPU Unit

UM: 7.2K words.
DM: 6K words.
EM: --.
Instruction processing time (basic instructions): 0.3 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10 C200HG-CPU63-E.
RS-232C: NO.Name: Heat/Cool Temperature Control Module.
Model: C200H-TV002 C200HG-CPU63-E
Sensor: Thermocouple: R, S, K, J, T, E, B, N, L, U.
Control output: Voltage output(transistor output used for cooling outputs).Model: C200H-BC101-V2.
No. of I/O slots: 10 slots.Name: Heat/Cool Temperature Control Module.
Model: C200H-TV101.
Sensor: Platinum resistance thermometer: JPt100, Pt100.
Control output: Transistor output C200HG-CPU63-E. C200H A Backplane I/O Mounting Bracket For 3 Slots C200H-ATT33.Model: C200H-MR433.
Description: RAM, 4K words, battery back-up.with clock (CPU21, CPU23 only).Model: C200H-ID217.
No. of points: 32 pts.
Specifications: 24 VDC.
Weight: 250g max.Model: C200HW-BC101-V1.
No. of I/O slots: 10 slots.Model: C200H-BC081-V2.
No. of I/O slots: 8 slots.UM: 15.2K words.
DM: 6K words.
EM: 6K words C200HG-CPU63-E.
Instruction processing time (basic instructions): 0.15 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/O Racks: 2 Racks.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.24 VDC, Wired.Model: C200H-OD213.
No. of points: 8 pts.
Specifications: 2.1 A, 24 VDC.Model: C200H-BC051-V2.
No. of I/O slots: 5 slots.Model: C200H-IA221.
No. of inputs: 8 pts.
Input voltage: 200 to 240 VAC, +10%/–15%.
Input current: 10mA, 200VAC.
Isolation: Photo-coupler.
Indica-tor: LED.
External connec-tions: Remove-able termi-nal blocks.
Inputs percom-mon: 8 pts.
Internal currentcon-sump-tion: Model: C200HW-COM04-V1.
Specifications: Communications port for the Controller Link, SYSMAC LINK Units, one RS-2332C port, and a protocol macro function C200HG-CPU63-E. UM: 31.2K words.
DM: 6K words.
EM: 6Kx3 banks(18K) words.
Instruction processing time (basic instructions): 0.1 µ.s min.
No. of I/O points: 880 points.
Max. no.of con-necting Expansion I/OO Racks: 2 Racks C200HG-CPU63-E.
Max. no. of connecting High-density I/O Units(i.e., Group-2): Unavailable.
Max. no. of con-necting Special I/O Units: 10.
RS-232C: NO.